期刊文献+

纳米多层膜的制备方法及比较 被引量:2

The Preparing Process of Nano Multilayers and Some Comparisions
下载PDF
导出
摘要 介绍了制备纳米多层膜的物理和化学方法,并对它们的优劣进行了比较。 The paper introduces the preparing processes of nano multi-layers by physical and chemical methods, and compares the advantage and disadvantage of the methods.
出处 《唐山师范学院学报》 2006年第5期61-63,共3页 Journal of Tangshan Normal University
基金 河北省教育厅资助项目(2002108) 唐山师范学院资助项目(03CG10)
关键词 纳米多层膜 制备 物理方法 化学方法 nano multi-layers preparing process physical method chemical method
  • 相关文献

参考文献23

二级参考文献122

  • 1游阳明,张国庆.电沉积制备纳米迭层薄膜材料[J].电镀与精饰,1995,17(4):20-23. 被引量:10
  • 2[1]Baibich M N, Broto J M, Fert A. Giant magnetoresistance of (001)Fe/(001) Cr magnetic superlattices[J]. Phys Rev Lett, 1988, 61(21): 2472-2475.
  • 3[2]Yukimi Jyok,Satoshi Kashiwabara,Yasunori Hayashi. Preparation of giant magnetoresistance Co/Cu multilayers by electrodeposition[J]. J Electrochem Soc, 1997, 144(1): 5-8.
  • 4[3]Gyana R Pattanaik, Dineshk Pandya, Subhash C Kashyap. Giant magnetoresistance in Cu-Co films electrodeposited on n-Si[J]. J Magnetism and Magnetic Materials, 2001, 234(2): 294-298.
  • 5[4]Ggomez E, Labarta A, Llorente A. Electrodeposited cobalt and copper thin films on ITO substrata[J]. J Electroanalytical Chemistry, 2001, 517(1): 63-68.
  • 6[5]Fanity H El, Rahmouni K, Bouanani M. Structural properties of electrodeposited Co/Cu multilayers[J]. Thin Solid Films, 1998, 318(2): 227-230.
  • 7[6]Lashwore D S, Dariel M P. Electrodeposited Cu-Ni Textured Superlattices[J]. J Electrochem Soc, 1998, 135(5): 1218-1221.
  • 8Lashwore D S,Dariel M P. [J]. J Electrochem Soc,1998,135(5) 1218:
  • 9Lton H, Hori T,Loue J, et al. [J]. J Magn Magn Mate,1994,136:33.
  • 10Baibich M N, Broto J M, Fert A, et al. [J]. Phys Rev Lett, 1988,61 (21): 2472.

共引文献114

同被引文献29

  • 1任毅,周家斌,付志强,王成彪,吕建国,于翔,彭志坚.纳米多层超硬膜力学性能研究进展[J].金属热处理,2007,32(5):6-9. 被引量:8
  • 2辜敏,李强,鲜晓红,卿胜兰,刘克万.PEG-Cl^-添加剂存在下的铜电结晶过程研究[J].化学学报,2007,65(10):881-886. 被引量:20
  • 3肖晓玲.纳米多层膜的研究进展[J].材料研究与应用,2007,1(1):1-10. 被引量:8
  • 4Gupta D, Nayak A C, Mazhe R J, et al. In-situ atomic force microscopic study of reverse pulse plated Cu/Co-Ni-Cu films[J]. Journal of Materials Science, 2004, 39(5): 1615-1620.
  • 5Grujicic D, Pesic B. Electrodeposition of copper: the nucleation mechanisms[J]. Electrochimica Acta, 2002, 47(18): 2901-2912.
  • 6Budevski E, Staikov G, Lorenz W J. Electrocrystallization nucleation and growth phenomena[J]. Electrochimica Acta, 2000, 45(12): 2559-2574.
  • 7Scharifker B, Hills G. Theoretical and experimental studies of multiple nucleation[J]. Electrochimica Acta, 1983, 28(7): 879-889.
  • 8陈永言,喻敬贤,黄清安.铜离子对镍电沉积行为的影响[C].郦振声,高万振.第二界表面工程国际会议论文集.武汉,2000.137-139.
  • 9Gomez E, Muller C, Proud W G, et al. Electrodeposition of nickel on vitreous carbon: influence of potential on deposit morphology[J]. Journal of Applied Electrochemistry, 1999, 22(9) 872-876.
  • 10陈永言 喻敬贤 黄清安.铜离子对镍电沉积行为的影响.材料保护,.

引证文献2

二级引证文献13

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部