微米级铜粉化学镀银及抗氧化性分析

Antioxidation Behavior of Micron-Sized Copper Powders Coated with Electroless Silver Plating

采用化学镀的方法在微米级铜粉表面镀银。用X射线衍射法(XRD)和热重分析法(TG)测定了铜-银粉的物相和抗氧化性,比较了由镀前有无活化的铜粉所制备的两种金属粉体的性能,最后用X射线荧光光谱仪对两种粉体的表面元素和含量进行测定。结果表明镀银能明显提高铜粉抗氧化性,而镀前经活化的铜粉具有更好的活性,银在铜粉表面含量达到93.27%。

Micron-sized copper powders were electroless plated with silver to prepare the two-phase metallic powders of copper coated with silver. The phase composition and antioxidation behavior of the Ag-Cu powders were investigated using X-ray diffraction and thermogravimetric analysis. The effect of activation of the copper powders by palladium chloride before electroless plating on the antioxidation behavior of the Ag-Cu powders was examined, while the elemental compositions of the two types of Ag-Cu powders made from the activated and non-activated micron-sized copper powders were determined using X-ray fluorescent spectroscopy. It was found that electroless silver plating contributed to greatly improving the antioxidation behavior of the copper powders. Moreover, the activation of the copper powders before the electroless silver plating was beneficial to increasing the reactivity of the copper powders, and the corresponding Ag-Cu powders had a Ag content as much as 93.27%.