铜-铝-铜三层复合板内部涡流场分布研究

Analysis on eddy current field in copper and aluminum composite plate

利用有限元分析软件ANSYS对新型铜-铝-铜三层复合板内部涡流场进行模拟计算.在铜、铝、铜三层厚度之和一定的条件下,改变复合板的电流加载和其它尺寸,得到同一复合板在不同电流加载情况下的电流密度分布,以及相同电流加载不同铜层厚度时所对应的电流密度分布,同时计算出各种情况下复合板的总阻抗.实验表明:在加载一定的情况下,流经复合板的电流和总体阻抗随着铜覆盖层厚度的增加逐渐减小,增到一定厚度以后,电流和阻抗的变化就很小了;在电压一定的条件下,随着电流频率的增加,铜铝复合板中心线处的电流密度呈变小的趋势;根据仿真得出:复合板阻抗值随电流频率的改变呈线性变化规律,该结论为实现用铜-铝-铜三层复合板取代纯铜及纯铝母线排提供了理论和设计依据.

The eddy current fields in three-layer copper and aluminum composite plates were analyzed using the software ANSYS. Setting the sum of thickness of each layer as a constant, the eddy current desity in the composite plate and its impedance were obtained with different currents and thickness values of the copper layer. In addition, based on the computational data, when load condition is fixed, the total current and impedance of the composite plate are reduced with the increase of copper layer thickness. However, the change becomes very small if the thickness reachess reaches a certain value. When voltage amplitude is fixed, the current density on central lines of the composite plate is cut down with the frequency＇ s expansion. From simulation results, the impedance variety is obtained. Theoretic and design bases are provided for the composite plate instead of pure copper or pure aluminum bus-bar.