摘要
介绍了电子电镀中的若干新工艺新技术,如芯片电镀、电化学机械研磨、微机电系统电镀、不溶性阳极电镀铜、镀铂铌电极以及无铅无镉中磷光亮化学镀镍、碱性蚀刻液再生和铜回收系统等。
Some new processes and technologies for electronics finishing were introduced, such as wafer plating, electrochemical mechanical polishing, mieroeleetro-meehanieal system plating, copper plating using insoluble anode, platinized niobium electrode, lead and cadmium free eleetroless nickel, recycling of alkaline etching solution and reclaiming system of copper.
出处
《电镀与涂饰》
CAS
CSCD
2006年第9期4-7,共4页
Electroplating & Finishing
关键词
电子电镀
芯片电镀
电化学机械研磨
微机电系统电镀
不溶性阳极
镀铂铌电极
无铅无镉化学镀镍
碱性蚀刻液再生
铜回收
electronics finishing
wafer plating
electrochemical mechanical polishing
mieroeleetro-meehanieal system plating
insoluble anode
platinized niobium electrode
lead and cadmium free eleetroless nickel plating
recycling of alkaline etching solution
reclaiming of copper
