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电子电镀中若干新工艺和新技术 被引量:4

Some new processes and technologies for electronics finishing
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摘要 介绍了电子电镀中的若干新工艺新技术,如芯片电镀、电化学机械研磨、微机电系统电镀、不溶性阳极电镀铜、镀铂铌电极以及无铅无镉中磷光亮化学镀镍、碱性蚀刻液再生和铜回收系统等。 Some new processes and technologies for electronics finishing were introduced, such as wafer plating, electrochemical mechanical polishing, mieroeleetro-meehanieal system plating, copper plating using insoluble anode, platinized niobium electrode, lead and cadmium free eleetroless nickel, recycling of alkaline etching solution and reclaiming system of copper.
作者 郁祖湛
机构地区 复旦大学化学系
出处 《电镀与涂饰》 CAS CSCD 2006年第9期4-7,共4页 Electroplating & Finishing
关键词 电子电镀 芯片电镀 电化学机械研磨 微机电系统电镀 不溶性阳极 镀铂铌电极 无铅无镉化学镀镍 碱性蚀刻液再生 铜回收 electronics finishing wafer plating electrochemical mechanical polishing mieroeleetro-meehanieal system plating insoluble anode platinized niobium electrode lead and cadmium free eleetroless nickel plating recycling of alkaline etching solution reclaiming of copper
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