倒装芯片的高速度、低成本、无铅化挑战

The High-Speed,Low-Cost,Lead-Free Challenge for Flip-Chips

有机基板上的倒装芯片已经成为一种具有稳定结构的成熟工艺技术。对高容积应用而言,这一技术更加可靠,并且比板上芯片更能节省成本,其成本价格已经接近于表面贴装技术的成本价格。对于很多需要高速的应用而言,也要求其具有优越的电性能。不过目前这一技术依然存在部分挑战,主要来自目前无铅化封装的全球趋势对于芯片封装无铅化提出的要求。

In the article, flip-chip onto organic substrates has become a mature process with a stableinfrastructure. For high-volume applications, it is more reliable and less expensive than chip on board. It is approaching cost parity with surface-mount technology. Its superior electrical performance is also required for many high-speed applications. But some challenges remain.