MCM封装技术中的基板设计与分析

Design of Silicon Substrate for MCM Packaging

通过采用多芯片组件封装技术,将6种由不同集成电路工艺实现的不同类型的芯片集成在单个封装内,简化了系统设计,实现了产品小型化的目标。同时,还详细给出了Zeni EDA工具下的MCM基板设计流程以及MentorPCB环境下的多芯片组件热分析方法。

Based on MCM technology, an approach which implemented six discrete chips arranged in a singlepackage was presented in this paper. It was helpful to improve the integration of electronic system. After the introduction of silicon substrate design flow in Zeni EDA layout tool, thermal distribution in MCM packaging was analyzed by using the Autotherm tool of Mentor Graphics＇ PCB Boardstation products. The practical application implies that multiple bare dice implemented in different technology can be packaged into a standard IC package and works well.