陶瓷四边引线扁平外壳工艺研究

The Research Study of Ceramic Quad Flat Pack

陶瓷四边引线扁平外壳具有体积小、重量轻、封装密度高、热电性能好、适合表面安装的特点,可广泛用于各种大规模集成电路封装,如ECL及CMOS门阵列电路等。文中叙述了CQFP陶瓷四边引线扁平外壳工艺研究中的关键工艺技术,如：金属浆料的配制工艺技术、大版精细印刷工艺技术、大腔体层压工艺技术、细引线拉力强度工艺技术等,以及今后努力的方向。

CQFP is a ceramic package with leads from four edges of the package. It is a compact, light weight, high reliability and good performance in thermal characteristics. It is suitable for surface mount assembly, It is widely used in packaging large scale integrated IC such as CMOS, ECL, and Grid Array. This article deals with topics in the critical process involved in the CQFP; such as metallization paste, precision large scale printing, big cavity iso-static pressing, pull strength for fine wire and its future direction for improvement.