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薄膜中晶粒正常生长过程的研究

Research of the Normal Grain Growth in Thin Films
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摘要 通过建立一个理论模型研究了薄膜中正常晶粒生长过程中晶粒的变化情况。晶粒按照边长数被分成不同的组,可以通过晶粒消失与晶界转换两种方式来改变边长的数目,在不同组之间进行转换。晶粒的长大与缩小由边长数与晶粒大小决定。计算机模拟的结果表明平均晶粒尺寸随时间呈线性增长,晶粒尺寸分布与已报道的结果基本一致。 This paper presents a model which describes normal grain growth in thin films. The grains are divided into different groups according to the number of their boundaries. The change of the grain boundary's number can be completed through two ways: the disappearance of a small triangle and the transfer from a rectangle to a triangle. The growth or shrinkage of the grains depend on the number of boundaries and their size. Simulated results show that the average size of grains increases linearly with time. The grain size distribution in this model is consistent with other works.
作者 韩钧 赵秀超
出处 《电子与封装》 2006年第9期38-40,共3页 Electronics & Packaging
关键词 薄膜 晶粒生长 平均晶粒尺寸 thin films grain growth the average size of grains
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