摘要
本文介绍了在制作半导体激光器的过程中,用热压球焊的方法代替电极压触的方法,减小了激光器的接触电阻,使激光器的阈值电流下降,输出功率提高。
Method of heat pressing-ball bonding instead of the electrode pressing contract method in the process of assembling the semiconductor lasers is introduced in this paper.Contact resistance of the lasers was reduced,threshold current of the lasers was reduced and output power of the lasers enhanced.
出处
《长春光学精密机械学院学报》
1996年第4期50-52,共3页
Journal of Changchun Institute of Optics and Fine Mechanics
关键词
热压球焊
半导体激光器
接触电阻
装配工艺
Heat pressing-ball Bonding
Semiconductor lasers
Contact resistance
