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BGA封装中含Bi,Ni的无铅焊球剪切强度研究 被引量：4

Shear Strength of Lead-Free Solder Ball Doped with Bi and Ni in BGA Packaging
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摘要 对Sn/3.5Ag/0.7Cu,Sn/3Ag/3Bi/0.5Cu和Sn/3Ag/3Bi/0.5Cu/0.1Ni三种BGA无铅焊球(0.76 mm)经不同热循环后,在FR-4基板上的剪切强度进行了测量.采用SEM和EDX对样品截面进行观察和元素分析.数据表明,Bi的掺入提高了焊料的润湿性及焊接强度,并减缓了IMC的生长速度;焊料中加入微量Ni可有效减小焊点下金属上Ni镀层的耗穿速度,抑制了焊球经热循环后焊接强度的下降. Shear strength of three kinds of BGA solder joints on FR-4 boerd with Cu pads is studied. The lead-free solders of Sn/3.5Ag/0.7Cu, Sn/3Ag/3Bi/0.5Cu and Sn/3Ag/3Bi/0.5CuA3.1Ni are used to make the BGA balls which are mounted on FR-4 board by solder reflow. After the thermal cycles, ball shear test was performed. In order to observe the microstructure and composition of IMC at interface, SEM and EDX are used to analyze of the samples. The experiment data show that Bi enhances the strength of solder joints by reducing the growth rate of IMC at the interface between solder and Cu pads; while Ni is effective to suppress the decreasing of the solder joints strength by depressing the consumption of the plated Ni on UBM.
作者 华彤 王珺 俞宏坤 肖斐
机构地区 复旦大学材料科学系
出处 《复旦学报（自然科学版）》 CAS CSCD 北大核心 2006年第4期489-494,共6页 Journal of Fudan University：Natural Science
基金 APEC科技产业合作基金资助项目
关键词 半导体工艺 无铅焊料 球栅阵列封装 封装可靠性 金属间化合物 semiconductor process lead-free solder BGA package reliability IMC
分类号 TN306 [电子电信—物理电子学]
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参考文献12

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二级参考文献12

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共引文献5

同被引文献25

  • 1王薇,王中光,冼爱平,尚建库.CBGA结构热循环条件下无铅焊点的显微组织和断裂[J].金属学报,2006,42(6):647-652. 被引量：7
  • 2薛松柏,韩宗杰,王慧,王俭辛.矩形片状元件无铅焊点断裂机制[J].焊接学报,2006,27(8):23-26. 被引量：4
  • 3薛松柏,吴玉秀,崔国平,张玲.热循环对QFP焊点强度及其微观组织影响规律的数值模拟[J].焊接学报,2006,27(11):1-4. 被引量：15
  • 4[2]Xue Songbai,Wang Hui,Hu Yongfang.Effects of thermal cycling on soldering joints' shear strength of laminar ceramic resistor[J].Transactions of Nonferrous Metals Society of China,2005,15(S3):305-310.
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引证文献4

二级引证文献15

复旦学报（自然科学版）
2006年 第4期

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