摘要
By means of electron assisted hot filament chemical vapour deposition technology, nanocrystalline diamond films are deposited on polished n-（100）Si wafer surface at I kPa gas pressure. The deposited films are characterized with a Raman spectrometer, atomic force microscope, semiconductor characterization system and Hall effect measurement system. The results show that, when bias current is larger than 2 A, sheet hole concentration can increase to a value greater than 1013 cm-2 and undoped nanocrystalline diamond films with a p-type semiconducting characteristic form. Heterojunction between n-Si substrate and the nanocrystalline diamond films deposited with 2 A and 6 A bias current has an evident junction effect. Hole formation mechanisms in the films are discussed.
By means of electron assisted hot filament chemical vapour deposition technology, nanocrystalline diamond films are deposited on polished n-（100）Si wafer surface at I kPa gas pressure. The deposited films are characterized with a Raman spectrometer, atomic force microscope, semiconductor characterization system and Hall effect measurement system. The results show that, when bias current is larger than 2 A, sheet hole concentration can increase to a value greater than 1013 cm-2 and undoped nanocrystalline diamond films with a p-type semiconducting characteristic form. Heterojunction between n-Si substrate and the nanocrystalline diamond films deposited with 2 A and 6 A bias current has an evident junction effect. Hole formation mechanisms in the films are discussed.
基金
Supported by the National Natural Science Foundation of China under Grant No 60577040, the Shanghai Foundation of Applied Materials Research and Development （0404）, the Nano-technology Project of Shanghai （0452nm051, 05nm05046）, and the Shanghai Leading Academic Disciplines （T0101）.
