摘要
从人工分片研磨抛光的机理出发,提出一套全新的双螺旋线轨迹规划算法。该算法产生的螺旋线轨迹起始并终止于子片的外边界,内旋、外旋螺旋线之间用S形回转轨迹圆滑连接,使得连接所有子片的研磨抛光路径成为可能,以实现整张曲面无退刀的分片加工策略,可消除表面撞痕,降低工件的表面粗糙度。用Matlab对算法进行了仿真,规划的加工轨迹达到了预期效果。
Based on the principle of subdivision polishing, a novel double spiral tool-path planning algorithm was proposed. The tool path generated by this method starts and ends on the original border ofapatch. The screw in and screw out tool path are smoothly connected by an‘S＇ shaped returning sub path. So, it is possible to connect the adjacent tool-path easily and fulfill the machining strategy of subdivision polishing without tool retractions. The algorithm was verified with Matlab. The simulation shows that the tool path can eliminate the collisions and ensure lower roughness of work piece surface.
出处
《中国机械工程》
EI
CAS
CSCD
北大核心
2006年第18期1924-1927,共4页
China Mechanical Engineering
基金
吉林省科技发展计划重点项目(20040325)
