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微量稀土及工艺参数对SnAgCu钎料合金润湿特性的影响 被引量:10

Effect of Tiny Rare Earth and Soldering Parameters on Wetting Properties of SnAgCu Solder Alloy
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摘要 选用商用水洗钎剂,采用润湿平衡法研究了Sn2·5Ag0·7CuXRE系钎料合金在不同钎焊工艺参数下对表面组装元器件润湿特性的影响。研究结果表明:添加微量稀土(RE)可改善钎料的润湿特性,当RE添加量(质量分数)达0·1%时,润湿效果最好;钎焊温度升高、钎焊时间和预热时间延长,可不同程度提高润湿力,但钎焊温度过高、时间过长,润湿力下降;Sn2.5Ag0.7Cu0.1RE钎料合金在最佳钎焊工艺参数钎焊温度250℃、预热时间15s、钎焊时间5s时,润湿力最大,达到现行商用Sn3.8Ag0.7Cu钎料合金的润湿力,能满足表面组装对无铅钎料润湿性能的要求。 The effect of wetting properties of Sn2. 5Ag0. 7CuXRE solder alloy on surface mount component by adopting commercial water-soluble flux were researched with different soldering parameters by wetting balance method. The experimental results show that the wetting properties of SnAgCuRE solder alloy can be improved with adding tiny rare earth (RE),the best of which is at 0.1wt% RE. The wetting force can be improved with higher soldering temperature and longer time of preheating and soldering, but it will be decreased with too high soldering temperature, too long preheating and soldering time. The biggest wetting force of Sn2. 5Ag0. 7Cu0. 1RE solder alloy under soldering temperature 250C, preheating time 15s and soldering time 5s can reach that of the commercial used Sn3.8Ag0.7Cu solder alloy, which can meet the wetting property standard to the lead-free solders of surface mount technology industry.
机构地区 河南科技大学
出处 《中国机械工程》 EI CAS CSCD 北大核心 2006年第18期1963-1966,共4页 China Mechanical Engineering
基金 河南省高校创新人才基金资助项目(2004294) 河南省高校杰出科研人才创新工程项目(2004KYCX020) 河南省青年骨干教师项目(2002114)
关键词 Sn2.5Ag0.7CuXRE钎料合金 润湿平衡法 润湿力 润湿特性 Sn2.5Ag0.7CuXRE solder alloy wetting balance method wetting force wetting pro priety
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