工艺参数对TiO_2-Ag烧结体导电性的影响

Effect of Technical Parameter on the Conductivity of TiO_2-Ag Agglomeration

用sol-gel法粉体技术制备TiO2粉,在TiO2粉体上用化学镀的方法制备了Ag为包覆层的复合导电粉体。测试TiO2-Ag复合导电粉体的体积电阻率,讨论了含银量、压力、煅烧温度对其体积电阻率的影响。试验结果表明,制备的粉体导电性能良好,且粉体烧结温度低。

The nanometer TiO2 powder was prepared by sol-gel method. The compound conductive micro-powder with Ag coating layer on the TiO2 micro-powder was prepared by electroless plating. The volume resistivity of the TiO2-Ag compound powder was measured. The effect of the content of Ag, pressure and temperature on the conductivity of the compound micro-powder were discussed. The results indicate that the conductivity of the structure of Ag coating on TiO2 substrate have better conductivity and can be sintered at lower temperature.