摘要
综述了导热胶粘剂的导热机理、导热模型以及提高胶粘剂导热性能的途径；详细介绍了非绝缘导热胶粘剂和绝缘导热胶粘剂的技术研究与应用,最后对导热胶粘剂的发展前景作了展望。
In this paper, the thermal conducting mechanism and models of thermal conductive adhesive were described,and the approaches of improving thermal conducting were also discussed. The research and applications of thermal conductive adhesives and thermal conductive insulating adhesives were introduced in detail. In the paper end ,the development prospect of thermal conductive adhesive was forecasted.
出处
《中国胶粘剂》
CAS
2006年第9期46-50,共5页
China Adhesives
关键词
导热胶粘剂
导热填料
导热机理
导热模型
thermal conductive adhesive
thermal conducting fillers
thermal conducting mechanism
thermal conducting models
