期刊文献+

AlGaN势垒层应变弛豫度对高Al含量Al_xGa_(1-x)N/GaN HEMT性能的影响 被引量:1

原文传递
导出
摘要 采用数值算法自洽求解Poisson和Schrdinger方程,计算了AlGaN势垒层的应变弛豫度对高Al含量AlGaN/GaN高电子迁移率晶体管(HEMT)中的导带结构、电子浓度以及二维电子气(2DEG)薄层电荷密度的影响.利用所获得的精确薄层电荷密度与栅电压的关系,采用非线性电荷控制模型解析求解了应变弛豫度对AlxGa1-xN/GaNHEMT直流输出特性的影响.计算表明,应变弛豫度为0时所获得的Al0.50Ga0.50N/GaNHEMT的最大二维电子气薄层电荷密度为2.42×1013cm-2,最大漏电流为2482.8mA/mm;应变弛豫度为1时所获得的最大二维电子气薄层电荷密度为1.49×1013cm-2,最大漏电流为1149.7mA/mm.模拟结果同已有的测试数据相比,符合较好.对模拟结果的分析表明,对高Al含量的AlGaN/GaNHEMT进行理论研究时需要考虑应变弛豫度的影响,减小AlGaN势垒层的应变弛豫度可显著提高器件的性能.
出处 《中国科学(E辑)》 CSCD 北大核心 2006年第9期925-932,共8页 Science in China(Series E)
基金 国家重大基础研究项目(973)(批准号:51327020301) 国防预先研究项目(批准号:41308060106)资助
  • 相关文献

参考文献11

  • 1Pearton S J,Zopler J C,Shul R J,et al.GaN:processing,defects and devices.J Appl Phys,1999,86(1):1-78
  • 2Wu Y F,Keller B P,Fini P,et al.High Al-content AlGaN/GaN MODFET's for ultrahigh performance.IEEE Electron Device Lett,1998,19(2):50-53
  • 3Weimann N G,Manfra M J,Chakraborty S,et al.Submicron AlGaN/GaN HEMT with very high drain current density grown by plasma-assisted MBE on 6H-SiC.IEEE Electron Device Lett,2002,23(12):691 -693
  • 4Kumar V,Adesida I.AlGaN/GaN HEMT on sapphire.Fourth IEEE International Caracas Conference on Device,Circuits and Systems,2002,D048(17-19):1-6
  • 5Maeda N,Nishida T,Kobayashi N,et al.Two-dimensional electron-gas density in AlxGa1-xN/GaN heterostructure field -effect transistors.Appl Phys Lett,1998,73(13):1856-1858
  • 6Chu R M,Zhou Y G,Zheng Y D,et al.Influence of doping on the two-dimensional electron gas distribution in AlGaN/GaN heterostructure transistors.Appl Phys Lett,2001,79(14):2270-2272
  • 7Ambacher O,Foutz B,Smart J,et al.Two-dimensional electron gases induced by spontaneous and piezoelectric polarization in undoped and doped AlGaN/GaN heterostructures.J Appl Phys,2000,87(1):334-344
  • 8Vinter B.Subbands and charge control in a two-dimensional electron gas field-effect transistor.Appl Phys Lett,1984,44(3):307-309
  • 9Imanaga S,Kawai H.Novel AlN/GaN isulated gate heterostructure field effect transistor with modulation doping and one-dimensional simulation of charge control.J Appl Phys,1997,82(5):5843-5858
  • 10Yu T T,Brennan K F.Theorectical study of a GaN-AlGaN high electron mobility transistor including a nonlinear polarization model.IEEE Trans Electron Device,2003,50(2):315 -323

同被引文献44

  • 1刘键,李诚瞻,魏珂,和致经,刘果果,郑英奎,刘新宇,吴德馨.具有低欧姆接触电阻的高性能AlGaN/GaN HEMT器件研制[J].Journal of Semiconductors,2006,27(z1):262-265. 被引量:1
  • 2李娜,赵德刚,杨辉.AlGaN/GaN异质结中极化效应的模拟[J].中国科学(G辑),2004,34(4):422-429. 被引量:5
  • 3Zainuriah Hassan, Fong Kwong Yam, Yan Cheung Lee, et al. Effects of post annealing treatments on the characteristics of ohmic contacts on n-type A1GaN [J]. SPIE, 2005,5739: 169.
  • 4B Shen, H M Zhou,J Liu, et al. Ohmic contact and interfacial reaction of Ti/A1/Pt/Au metallic multi-layers on n-AlxGa1-xN/GaN heterostructures [ J ]. Optical Materials,2003, 23(1/2) :197 - 201.
  • 5G Vanko,T Lalinsk), z. Mozolovd, et al. Nb-Ti/A1/Ni/ Au based ohmic contacts to A1GaN/GaN[J]. Vacuum, 2007,82(2) : 193 - 196.
  • 6S Kaciulis, L Pandolfi, S Viticoli, et al. Characterization of Ohmic contacts on GaN/A1GaN heterostructures[J ]. Applied Surface Science, 2006,253(3) :1055 - 1064.
  • 7Deepak Selvanathan, Fitih M Mohammed, Jeong-Oun Bae, et al. Investigation of surface treatment schemes on n-type GaIN and A10.20Ga0.80N [J]. Journal of Vacuum Science Technology B, 2005, 23(6) :2538 - 2544.
  • 8J A Bardwell, G I Sproule, Y Liu, et al. Comparison of two different Ti/A1/Ti/Au ohmic metallization schemes for AlGaN/GaN [J ]. Journal of Vacuum Science Technology B, 2002, 20(4) :1444 - 1447.
  • 9Alexei Vertiatchikh, Ed Kaminsky, Julie Teetsov, et al. Structural properties of alloyed Ti/A1/Ti/Au and Ti/A1/ Mo/Au ohmic contacts to AIGaN/GaN [ J ]. Solid-State Electronics, 2006(7/8) : 1425 - 1429.
  • 10M A Miller, S-K Lin, S E Mohney. V/A1/V/Ag contacts to n-GaN and n-AIGaN [ J ]. Journal of Applied Physics, 2008,104 (6) : 4508.

引证文献1

二级引证文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部