“无铅”兼容高频覆铜板的开发

The Exploitation of “Free-lead” Compatible High-frequency CCL

本项目采用聚苯醚(PPE)、氰酸酯(CE)和环氧树脂,通过半互穿网络聚合物技术(Semi-IPN),成功开发了一种“无铅”兼容高频覆铜板。

This item adopt PPE,CE,epoxy resin which through the S-INP technology exploitation Lead-free compatible high-frequency CCL.