摘要
到目前为止,国际标准化组织对STEP集成的研究都集中到面向应用领域的AP的集成上。而不同AP之间的集成,日益成为集成研究中严重的障碍,到目前还没有找到解决方法。本文所提出的复合AP的研究,在国际上首次提出不同应用领域AP的集成的概念和方法,首次提出面向产品全生命周期信息集成的方法和实现手段。
To support the requirement of concurrent engineering (CE), we need current STEP APs interpretableto integrate different applications in different phases of the entire lifetime cycle of a product. COMpositionApplication Protocols (COMAP) introduced and discussed in this peper is proPOsed to solve this problem.COMAP, serving as a root AP, is built on top of existing STEP APs for mapping information among them.A prototype of COMAP (cadpp) based on AP203 and AP224 for CAD/CAPP integration is implementedand discussed.
出处
《高技术通讯》
CAS
CSCD
1996年第5期32-35,共4页
Chinese High Technology Letters
基金
863计划资助