离子注入技术制备Cu－AlN双晶体的晶体学性能

Crystallographic Proprties of Cu-AlN Bicrystal Made by Ions Implantation Technique

通过在高纯ＡＩＮ基片表面层区域注入Ｃｕ离子及随后恒温退火制取了低能组态的Ｃｕ－ＡｌＮ双晶体。应用透射电子显微术（ＴＥＭ）及卢瑟夫背散射（ＲＳＳ）等技术研究了这种双晶体的显微结构性能。纳米尺寸的Ｃｕ颗粒与ＡｌＮ基体之间总呈现出唯一的低能晶体学取向关系。镶嵌在ＡｌＮ基体中的Ｃｕ颗粒常常表现出呈李晶关系的片层状显微组织。这是因为在长大过程中，Ｃｕ颗粒通过孪生过程缓解了由于共格关系而产生的弹性应变能。

A metal-ceramic bicrystal Cu-AlN of low-energy configuration was prefered by isothermal annealing of a copper implanted AlN ceramic. In connection with TEM and RBS techniques, our study has been focused on the microstructural evalution of the bicrystal associated with the Cu precipitation in AlN ceramic matrix. Nanometer scale Cu articles and AlN matrix exhibit always a unique low energy orientation relationshap. In general, the Cu particles embedded in AlN matrix have a microstructure characterized by twin-related lamella. This is due to the relaxation, through twinning,of the elastic strain energy accumulated around the Cu particles during their growth.