锌压铸件镀无氰碱铜失败原因分析及改进 第二部分——改进实验

Causes of failure in non-cyanide alkaline copper plating process for zinc die-castings and the process improvement Part II—Improving tests

试验开发了一种以硝酸盐为主盐的无氰碱铜电镀工艺，用于锌压铸件电镀。该工艺的最佳配方和工艺条件为：40～45g／L硝酸铜，80～85g／L酒石酸钾钠，20～30g／L硝酸钾，10～15g／L氯化铵，30～35mL／L 三乙醇胺，0．02～0．06mL／LPN，8～40℃，电流密度1～6A／dm^2，pH7．5。该工艺采用添加硝酸钾补充阴极还原消耗的NO3ˉ能实现宽温度、宽电流密度范围电镀。同时试验了一种破络沉淀铜的方法处理无氰络合物镀铜废水。

A non-cyanide alkaline copper electroplating process for zinc die-castings was developed, in which nitrate was used as a main salt. The optimum formula and the process conditions were as follows：40-45 g/L copper nitrate, 80～85 g/L potassium sodium tartrate, 20～30 g/L potassium nitrate, 10～15 g/L ammonium chloride, 30～35 mL/L triethanolamine ,0. 02～0.06 mL/L PN, 8～40℃, current density of 1-6 A/dm2, pH 7.5. The nitrate consumed as a result of its cathodic reduction can be replenished by the addition of potassium nitrate. The process is able to be operated over a wide range of temperature and current density. A method for breaking the complex forming copper precipitation was tested for wastewater treatment of non-cyanide complex copper plating.