摘要
利用传统的电阻焊技术实现了MEMS真空封装,制定了基于熔焊的工艺路线,进行了成品率实验,研究了影响真空封装器件内部真空度的各种因素,并对真空封装器件封装强度进行了检测。
MEMS vacuum packaging is successfully implemented by using the traditional fusion weld- ing; the process has been investigated in details while evaluating the yield of finished products. The author also studied the factors influencing the pressure in the vacuum packaged MEMS devices, and measured the strength of the MEMS vacuum packed devices.
出处
《电子工业专用设备》
2006年第10期49-52,共4页
Equipment for Electronic Products Manufacturing
基金
国家863高技术发展资助项目(2005AA404260)
关键词
真空封装
MEMS
熔焊
Vacuum packaging
MEMS
Fusion welding
