主轴旋转精度对晶体切割精度影响的研究

Research on How the Main Spindle-axis Revolving Accuracy Affects the Cutting Precision of the Crystal Materials

通过对半导体材料内圆切割机主轴旋转精度和刚度的分析,提出了提高主轴旋转精度的措施,使主轴具有极高的动静态刚性和优良的热平衡结构,减小主轴轴向跳动和径向跳动,减小刀片工作面与晶体加工面之间的相对振动,从而将切割材料表面的冲击力降到最小,避免晶体材料切割中的飞片、碎片和刀纹。

This paper analyzes precision and rigidness of the revolving main spindle and gives the corresponding measures, so as to make main spindle have highly dynamic and static rigidness and excellent heat balance structure which can reduce the axial and radial jumpiness of main spindle, reduce the relative vibration between blade working surface and crystal processing surface, reduce the impact force given by the blade to the cutting material surface, and also reduce flying slices, fragments and blade ripples during the cutting of crystal materials.