摘要
在６０／４０的锡铅焊料中加入０．２％左右的铜，凝固后具有均匀细小的共晶组织，其熔点为１８３℃，焊点强度和扩展率均高于未加铜的６０／４０锡铅焊料，并且含铜的锡铅焊料在焊接时。
In this paper,the trace contents of 0 2%Cu is added into HL Sn Pb40 soldering materials. The microstrcuture of the alloy is small eutectic.The melting point is 183℃,the strength and the spread percoutage of soldering point are higher than HL Sn Pd40 soldering materials, and the soldering wire containing copper is of very little erosion effect on the copper head of soldering iron and thin copper wire.
出处
《电子工艺技术》
1996年第6期24-25,28,共3页
Electronics Process Technology
关键词
焊锡丝
铜
焊料
Soldering wire Copper Erosion effect of melting Structure of alloy
