摘要
聚酰亚胺树脂(PI)因其良好的平面化特性、在氧气中易灰化、不完全固化易溶解于碱性显影液、在CHF3等离子气氛中有较强的抗蚀性等性质,在电容RFMEMS开关的制作过程中,应用它作为刻蚀保护层和牺牲层,不但可以使工艺过程得到简化,而且可以对开关的介质层尺寸、牺牲层厚度等图形参数起到很好的控制作用.
As a kind of polymer material, polyimide（PI） holds a favorable complanation property and is easy to become ash in the oxygen. PI also can resist ion etching produced by the CHF3 plasma body and be easy to dissolve in alkali developer solution when it is not solidified completely. Basised on the properties mentioned above, PI can be used in the manufacture process of RF MEMS Capacitive Shunt Switch to achieve a precisely control on the size of dielectric layer, the thickness of sacrificial layer and some other graph parameters.
出处
《传感技术学报》
CAS
CSCD
北大核心
2006年第05B期1896-1899,共4页
Chinese Journal of Sensors and Actuators
关键词
聚酰亚胺
RF
MEMS电容式开关
光刻
牺牲层
保护层
polyimide （PI）
RF MEMS capacitive shunt switch
photolithography
sacrificial layer
protected layer
