微流控芯片微通道热压成形中塑料流动的仿真

Simulation of Plastic Flow in Microchannel Figuration of Microfluidic Chip Under Hot Embossing

目前,PMMA微流控芯片微通道成形过程中热压参数的调整周期很长.针对这一问题,本文基于热粘弹性理论建立微通道成形过程中的热-应力耦合场模型,利用有限元软件对微通道热压成形过程进行了仿真,通过对不同压力、温度和时间下微通道成形的仿真,得出了最优化的工艺参数.实验结果验证了仿真结论,可以实现对微流控芯片微通道热压成形过程的快速有效的控制.

At present, a long period is needed to adjust parameters of microchannel figuration under hot embossing for the fabrication of PMMA microfluidic chip. The author set up the model of thermal-stress coupled field and simulates the flow process of PMMA microchannel figuration under hot embossing with finite element analysis software based on the theory of heat viscoelasticity in order to meet the fast and efficient requirement of rectifying technical parameters. Through the simulation of different pressure, temperature and time, perfect technicas parameters, were obtained. The results of the experiments proved that the conclusions of simulation were available. The studies showed that it was efficient to control the hot embossing process through the simulation.