摘要
考虑残余应力的情况下,薄膜在大挠度时总应力的解析表达式.通过实验观察,深腐蚀得到的浓硼重掺杂硅薄膜表面存在微蚀坑.考虑微蚀坑和残余应力的影响,运用总应力表达式和Griffith裂口强度理论,定量的得到方形浓硼重掺杂硅薄膜的最大挠度和极限载荷Pmax,与已报道的实验值相符.从而解释了浓硼重掺杂硅薄膜的实际断裂强度值远小于晶体理论断裂强度值的矛盾.可以得出,极限载荷Pmax不仅与薄膜的尺寸与形状有关,而且也与材料特性,特别是与制备工艺有关.
Considering the residual stress, the total stress analytical solutions for square-shaped borondoped silicon diaphragms with large deflection are presented. With this total stress analytical solution and Griffith fracture criterion, the maximum displacement and load limitation Pmax of the square-shaped borondoped silicon diaphragms are calculated, and the results agree well with the reported experiment results. Load limitation Pmax is not only related with the shape and the dimension of diaphragms, but also dependent on material characteristics, especially the fabrication process.
出处
《传感技术学报》
CAS
CSCD
北大核心
2006年第05A期1617-1619,共3页
Chinese Journal of Sensors and Actuators
基金
北京市人才强教计划项目资助(5002015200504)