温度冲击下倒装芯片的热应力数值模拟研究

The Numerical Value Simulation Studying of Flip-Chip Thermal Stress Under Temperature Impulsion

由于几何材料的复杂性,倒装芯片封装中的热应力分布很难用解析的方法求解,而数值方法,如有限元法,已被广泛用于热应力应变的研究.二维有限元模型建模简单,模型的单元数和节点数较小,便于反复计算,微系统焊接中采用二维有限元模拟可提高数值模拟效率.本文对使用和未使用填充剂两种情况下的倒装芯片,采用有限元模拟方法研究了在温度载荷下整个结构的热应力、应变分布,并对结构可能造成的破坏性影响进行了定性和定量的分析.

Because of the complex of the geometry material, it is very hard to resolute the thermal stress distribution in Flip-Chip encapsulation, but the numerical value method, for instance finite element analysis, has been used in the studying of thermal stress and thermal strain. It is easy to model in 2D finite element, and the number of elements and nodes of the model are less which will make for the calculation continuously. It can improve the efficiency of numerical value method by using 2D finite element method in micro-system jointing. Aiming at the flip chip of no using and using the filling material, this paper adopt the finite element method to analysis the distribution of thermal stress and thermal strain under temperature loading, and analysis the devastating influence quantitatively and qualitatively.