SiC_p/Cu包覆粉体及其热沉材料的制备

Fabrication of Cu-coated SiC_p Powder and Its Heat Sink Materials

采用化学镀铜工艺制备了Cu包覆SiCp复合粉体,并对复合粉体的组成和形貌进行了分析。同时,利用制得的复合粉体,结合适当的热压烧结工艺制备了Cu-35SiCp热沉材料,并对热沉材料的微观组织和热物理性能进行了研究。结果表明,SiCp颗粒在热沉材料的基体中均匀分布,界面结合良好。在试验条件下,Cu-35SiCp热沉材料的导热系数为165.7W/(m.K),30～200℃温度区间内的热膨胀系数为15.1×10-6/K。

The composition and morphology of Cu-coated SiC_p powder prepared by electro-plating have been investigated.Moreover,Cu-35%SiC_p heat sink materials were fabricated by hot pressing based on the coated powder,and its microstructure and thermo-physical properties have been observed.The results show that SiC_p particle is uniformly distributed in the matrix with ideal interfacial bonding.With a given condition,the thermal conductivity of the Cu-35%SiCp heat sink materials is 165.7 W/(m·K)and the thermal expansion coefficient is 15.1×10-6/K in the range of 30～200 ℃,which provides a reference for further research.