填充银纳米线各向同性导电胶的性能

Isotropical conductive adhesives filled with silver nanowires

以Ti（OC4H9）4水解形成的溶胶体系为模板，以AgNO3为银纳米线的前驱体，低温下合成长径比为50～60的银纳米线，采用TEM和XRD对所制得的银纳米线进行表征。以银纳米线作为导电胶的导电填料，成功制备了一种高电导率的各向同性导电胶。导电胶的电学性能和力学性能测试表明：这种导电胶在导电填料含量为56wt％时的电导率比填充75wt％微米银粒子的导电胶高约6倍（体积电阻率为1．2×10^-4Ω·cm）。由于填料含量的降低，该导电胶的抗剪切强度（以Al为基板时的抗剪切强度为17．6MPa）相比于填充75wt％微米银粒子和75wt％纳米银粒子导电胶均有不同程度的提高。

With the nanoporous templates formed by the controlled hydrolysis and condensation of butyl titanate （Ti（OC4 H9 ）4 ）, silver （Ag） nanowires with a slenderness ratio of 50 - 60 were prepared by using silver nitrate （ AgNO3） as precursor. The prepared Ag nanowires were characterized by X-ray diffraction （XRD） and transmission electro microscopy （TEM）. A new kind of isotropical conductive adhesive （ICA） was developed by using these Ag nanowires as conductive filler. The bulk resistivity and shear strength testing results show that the novel ICA filled with Ag nanowires （mass fraction 56%） has bulk resistivity （1.2×10^-4,Ω·cm） 6 times lower than that of ICA filled with Ag particles （mass fraction 75%）. For the lower filler content, the ICA filled with Ag nanowires exhibits higher shear strength （17.6 MPa on Al substrate） than the ICA filled with micrometer-sized Ag particles or nano meter-sized Ag particles cloes.