短碳纤维增强铜基复合材料制备新工艺

New Preparation Technology of Copper Matrix Composites Reinforced by Short Carbon Fibers

开发了一种对短碳纤维直接电镀铜的新方法,并将得到的镀铜短碳纤维直接进行冷压烧结制备铜基复合材料,对镀铜碳纤维和复合材料的组织和性能进行了研究。结果表明:电镀得到的电沉积物呈疏松多孔状,且镀层均匀可控;在铜基复合材料中,碳纤维分布均匀,界面结合良好;随着碳纤维含量的增加,复合材料的抗弯强度、硬度也随之增加,但电导率、热导率有所降低;复压复烧工艺能显著提高复合材料的强度;在电镀工艺为3．0 A／dm2、60 min时,制得的复合材料中碳纤维体积分数为17．9％,综合性能较佳,抗弯强度为282．1MFa,硬度为96．5 HV,电导率为24．5 m／(Ωmm2),热导率为193．2 W／(mK),经复压复烧后抗弯强度、硬度分别达到327．6 MPa,119 HV。

A new method of direct electrodeposition on copperized short carbon fibers （CFs） was developed and copper matrix composites were prepared by cold press and sintering. The microstructure and properties of the Cu-coated short CFs and composites were studied. The electrodeposits had a loose porous structure formed by the aggregated short CFs, the coatings were uniform and controllable. In the Cu/short CFs composites, short CFs distributed homogeneously and the interfaces between short CFs and copper were well-bonded. With the increase of short CFs contents, the flexure strength and hardness of the composites increased, however, the electrical conductivity and thermal conductivity decreased. The process of repress and resintering can improve the strength of composites obviously. When process parameters of electrodeposition were 3.0 A/dm^2 and 60 min, the composite with a 17. 9% volume fraction of CFs exhibited optimum combination properties, i. e. , the flexure strength was 282. 1 MPa, hardness 96. 5 HV, electrical conductivity 24. 5 m/（Ωmm^2）, thermal conductivity 193. 2 W/（mK）. After the process of repress and resintering the flexure strength and hardness were improved to 327. 6 MPa and 119 HV, respectively.