双络合剂化学镀铜液的稳定性和沉铜速度研究

Study of the stability and Cu Deposition Rate of Bicomplex Electroless Cu Bath

本文提出了以酒石酸钾钠和EDTA为络合刺的双络合剂体系的化学镀铜液,它比单络合剂体系具有更高的沉铜速度和稳定性。通过研究镀液成分及工艺操作条件对镀液稳定性和沉铜速度的影响,确定了化学镀铜槽液的配方及工艺规范:硫酸铜CuSO_4·5H_2O 16g/L、酒石酸钾钠(NaKC_4H_4O_6·4H_2O)15g/L,EDTA.2Na 24g/L,氢氧化钠(NaOH)14g/L,甲醛(36％HCHO)16mL/L,a.a-联吡啶24mg/L,亚铁氰化钾(K_4Fe(CN)_6)12mg/L,温度40℃。该镀液稳定性高,沉速在2.5-3μm/20min。镀层延展性好,平整、外观良好,可用于印制线路板的孔金属化及其它塑料电镀。

An electroless Cu bath with a bicomplex system, consisting of potassium sodium tartrate and EDTA, is presented. The bath has higher stability and Cu deposition rate than mono- complex system. By studying the effects of bath components and operation conditions on the stability and Cu deposition rate, the composition and procedures of the Electroless Cu bath are determined as follows: CuSO_4. 5H_2O 16g/L, Potassium sodium tartrate 15g/L, EDTA. 2Na 24g/L, NaOH 14g/L, 36% HCHO 16mL/L, a, a'-dipyridyl 24mg/L, potassium ferrocyanide 12mg/L, and temperature 40℃. The bath is highly stable with deposition rate of 2.5-3μm/20min and its deposit has a good ductility with a good smooth appearance. It can be used to metalize holes of PCB and plate on plastics.