红外加热技术在BGA返修焊接中心的应用

Application of Infrared Heating Technology to BGA Rework Soldering Center

在大规模集成芯片中以BGA(球栅阵列)封装的IC芯片被广泛使用。而在贴片焊接中返修工作始终是整个生产环节中的一个重要组成部分。多年来SMT的返修系统几乎是热风系统一统天下,然而在实际使用中,尤其是在对BGA、CSP先进封装器件电路板的返修过程中,热风返修系统却暴露出很多明显的缺点。为解决有关技术问题,采取红外加热技术克服热风返修系统存在的缺点,提高BGA返修的成功率,同时也降低了使用费用。本文详细介绍了在BGA返修设备中由传统的热风焊接方式,发展到红外加热控制形式及其控制原理。

In large scale integrated chip field, the IC of BGA encapsulation was widely used. Rework of SMT always was an important component part of manufacturing process. The hot air system was the hold sway in the SMT rework system, but there still have many obvious weakness of hot air system application specially in the BGA and CSP chip. For solve the technique problem, we adopted infrared heating technology to get over the weakness of the hot air rework system, improve the success rate, and decrease the application expenses. In this paper, we analyzed the traditio- nary hot air soldering technology of BGA rework equipments, and described the development of control principle control form for infrared heating.