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球栅阵列封装中SnPb焊点的应力应变分析 被引量：2

Analysis on Stress and Strain Distribution of SnPb Solder Joint in BGA Package
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摘要 基于SnPb焊料的统一粘塑性Anand本构模型,运用ANSYS有限元软件分析了球栅阵列封装中复合SnPb焊点在热循环过程中的应力、应变的分布,观察到SnPb焊料的蠕变行为和应力松弛现象,结果证明:外侧焊点经受的应力、应变范围比内侧焊点大;焊点的最高应力区域出现在Sn60Pb40焊料的最外缘处,最高应变区域出现在Pb90Sn10焊料与UBM层接触面的最上缘处。 Based on the unified viscoplastic Anand model, using of ANSYS software, the distribution of the stress and strain in duplex SnPb solder joint during thermal cycling loading was analyzed. The creep and stress relaxation of the duplex SnPb solder joint were observed. The results show that the stress and strain value of the outside solder joint is greater than the inside solder joint; The most high stress area is at the extreme periphery of Sn60Pb40, the most high strain area is at the most upper limb of Pb90Sn10 and UBM surface.
作者 陈云 徐晨
机构地区 东南大学集成电路学院 南通大学电子信息学院
出处 《半导体技术》 CAS CSCD 北大核心 2006年第11期823-827,共5页 Semiconductor Technology
关键词 SnPb焊点 应力应变分布 ANSYS软件 球栅阵列 SnPb solder joint stress and strain distribution ANSYS BGA
分类号 TN45 [电子电信—微电子学与固体电子学]
  • 相关文献

参考文献4

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二级参考文献4

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共引文献41

同被引文献16

  • 1蒋长顺,谢扩军,许海峰,朱琳.封装中的界面热应力分析[J].电子与封装,2006,6(8):23-25. 被引量：18
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半导体技术
2006年 第11期

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