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大功率半导体激光器阵列热特性分析 被引量:4

Thermal Analysis of High Power Semiconductor Laser Arrays
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摘要 基于实际器件的材料和结构参数,利用ANSYS软件对泵浦用808nm半导体激光器一维线阵列在连续及准连续驱动条件下的稳态及瞬态温度分布进行了模拟和分析,并采用纵模光谱法对稳态热阻进行了测量,实测与模拟结果基本吻合。 Transient and stationary thermal field distribution of 808 nm semiconductor laser arrays in CW and PCW conditions, were simulated by Ansys software, in which the structure parameters were all based on the practical devices. The stationary thermal resistant was also measured by vertical-mode spectrum method, the results were basically coincident with the simulations.
出处 《半导体技术》 CAS CSCD 北大核心 2006年第11期843-846,共4页 Semiconductor Technology
基金 长春光机学院重点实验室基金资助项目(51456030103DZ2302)
关键词 半导体激光器阵列 温度分布 ANSYS软件 semiconductor lasers arrays temperature distribution ANSYS
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  • 1YI H J,DIAZ J,ELIASHEVICH I,et al.Temperature dependence of threshold current density Jth and differential efficiency ηd of high-power InGaAsP/GaAs (λ= 808 nm)lasers[J].Appl Phys Lett,1995,66(3):253-255.
  • 2PUCHERT R,BARWOLFF A,VOB M,et al.Transient thermal behavior of high power diode laser arrays[J].IEEE Trans on Compoents,2000,23(1):95-100.
  • 3ZHANG Y G,HE Y J,NAN K J,et al.Thermal analysis and characterization of semiconductor lasers[J].Chinese J of Rare Metals,2004,28(3):551-553.
  • 4鲁鹏程,崔碧峰,李建军,廉鹏,郭伟玲,邹德恕,沈光地.隧道再生大功率半导体激光器瞬态热特性研究[J].中国激光,2004,31(5):518-522. 被引量:12

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