Wayne Koh博士“封装技术回顾”“微电子组装基础”实训讲座

课程目标 回顾从传统的单芯片引线框架类型到先进的芯片尺寸封装技术，多芯片封装，3D堆叠以及系统封装（SIP）的半导体封装技术的设计、材料和组装工艺。

Overview of the design, material, and assembly process for semiconductor packaging technology from conventional single chip leadframe type to advanced chip scale package, multichip packaging and 3-D stacking, and System in Package （SIP）