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Bi-Sn-In控温易熔合金的设计与性能 被引量:1

Design and properties of Bi-Sn-In ternary fusible alloys
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摘要 在Bi-Sn、Bi-In、Sn-In二元相图的基础上,设计出系列Bi-Sn-In控温易熔合金,并对合金的熔点、相组成和钎焊接头的力学性能进行了研究。结果表明:低铟含量的Bi-Sn-In合金由Bi、-βSn和InBi相组成;随Sn、In含量的增加,易熔合金的相组成向BiIn、BiIn2和γ(InSn4)转化;合金的固相线、液相线随Bi含量或Bi/In的增大而提高,且当Sn含量(质量分数)为17%时合金的液相线最低;易熔合金的硬度随Bi含量或Bi/In的增加而线性增大,但随Sn含量、In含量的增加而降低;提高合金的Sn含量和Bi/In,可使合金钎焊接头的剪切和抗拉强度得到明显的改善;42.6Bi-17.0Sn-40.4In合金的熔点、熔程和钎焊接头的力学性能与50.0Bi-25.0Pb-2.5Sn-12.5Cd伍德合金相当,符合72℃自动灭火洒水喷头感温元件的要求。 Series of Bi-Sn-In ternary fusible alloys were designed based on Bi-Sn, Bi-In and Sn-In phase diagrams, and the melting temperature, phase composition and mechanical properties of these alloys were measured and determined. The results show that Bi-Sn-In ternary fusible alloy with low content of indium consists of Bi,β-Sn and InBi phases. With increasing content of indium and tin in fusible alloy, the phase components turn to BiIn, BiIn2 and γ (InSn4) phases. The solidus and liquidus of alloys increase linearly with increasing content of bismuth or the ratio of Bi to In, and there is a minimum solidus at 17% Sn(mass fraction). Fusible alloys with higher content of bismuth or higher ratio of Bi to In have a higher hardness, whereas the contents of indium and tin have opposite effect. Meanwhile the shear and tensile strengths of soldering joints can be improved by the promotion of tin content and the Bi/ In ratio in Bi-Sn-In alloy. The melting temperature and mechanical properties of 42. 6Bi-17. 0Sn-40.4In alloy are comparable to those of 50.0Bi-25.0Pb-12.5Sn-12.5Cd Wood alloy, and can be used as the material for 72 ℃ thermal actuator in automatic sprinkler instead of Wood alloy.
出处 《中国有色金属学报》 EI CAS CSCD 北大核心 2006年第10期1653-1659,共7页 The Chinese Journal of Nonferrous Metals
基金 教育部留学回国人员科研启动基金资助项目(413175)
关键词 无铅焊料 易熔合金 熔点 力学性能 感温元件 lead-free solder fusible alloy melting temperature mechanical property thermal actuator
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参考文献15

  • 1Abtew M,Selvaduray G.Lead-free solders in microelectronics[J].Materials Science and Engineering R:Reports,2000,27(5-6):95-141.
  • 2Yoon S W,Choi W K,Lee H M.Calculation of surface tension and wetting properties of Sn-based solder alloys[J].Scripta Materialia,1999,40(3):297-302.
  • 3Ohnuma I,Miyashita M,Anzai K,et al.Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys[J].J Electron Mater,2000,29(10):1137-1144.
  • 4Igoshev V I,Kleiman J I.Creep phenomena in lead-free solders[J].J Electron Mater,2000,29(2):244-250.
  • 5美国金属学会.金属手册(第9版,第6卷)[M].包芳涵译.北京:机械工业出版社,1994:1395.
  • 6王吉会,杨亚群,李群英,李顺成,刘振华.Bi-Pb-Sn-Cd易熔合金的设计与性能研究[J].材料开发与应用,2005,20(1):1-3. 被引量:3
  • 7长崎诚立,平林真.二元合金状态图集[M].刘安生译,北京:冶金工业出版社,2004:87,92,187.
  • 8凯尔A 默尔WA.电接触和电接触材料[M].北京:机械工业出版社,1993..
  • 9Kabassis H,Rutter J W,Winegard W C.Microstructure of one of the ternary eutectic alloys in the Bi-In-Sn system[J].Metall Trans A,1984,A15(8):1515-1517.
  • 10Morris J W,Goldstein J L F,Mei Z.Microstructure and mechanical properties of Sn-In and Sn-Bi solders[J].Journal of Metals,1993,45(7):25-27.

二级参考文献10

  • 1林肇奇.有色金属材料学[M].沈阳:东北工学院出版社,1986.220-230.
  • 2[2]John R. Sinons, John W. Fenske. Concealed Sprinkler Head. United States Patent. 4015665. 1977-04-5.
  • 3[3]Hiroshi Onuki. Automatic Sprinkler Head. United States Pstent. 6439315 2002-08-27.
  • 4[5]John T.M. Lee Ultrafast Thermal Actuator. United States Patent. 4,577,544. 1986-03-25.
  • 5[6]Polan. Quick Release Mechaninism for Sprinkler Head.United States Patent 4,732,216.1988-03-22.
  • 6[7]Tsuji Toshihide, Tonomura Toshiaki, Shimokawa Takashi. Sprinkler Head. Patent of Japan. 2000-167080.2000-06-20.
  • 7[8]B.J. Macartney. Sprinkler Head. United States Patent.3336984.1967-08-22.
  • 8简明大英百科全书编译部.简明大英百科全书(第l卷)[M].台北:台湾中华书局,1988..
  • 9Mulugeta Abtew,Guna Selvaduray.Lead-free solders in microelectronics[J],Materials Science and Engineering,2000,27:95--141.
  • 10美国金属学会.金属手册(第六卷)[M].北京:机械工业出版社,1994.1300~1378.

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