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SnAgCu/Cu和SnPb/Cu界面热剪切循环条件下化合物的生长行为 被引量：9

Growth behavior of compounds formed at Sn-3.5Ag-0.5Cu/Cu and Sn-Pb/Cu interfaces during thermal-shearing cycling
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摘要 对热剪切循环条件下Sn-3.5Ag-0.5Cu/Cu和Sn-Pb/Cu界面上原子扩散和化合物的生长行为进行了研究。结果表明:再流焊后,在两界面上均形成一种Cu6Sn5化合物;随着热剪切循环周数的增加,两界面上化合物的形态均从扇贝状向层状生长,其厚度随循环周数的增加而增加,且生长基本遵循抛物线规律,说明Cu原子的扩散控制了Cu6Sn5化合物的生长。界面近域的钎料内,颗粒状的Ag3Sn聚集长大成块状。 The atoms diffusion and growth behavior of intermetallic compounds （IMCs） at Sn-Ag-Cu/Cu and Sn-Pb/Cu interfaces under the thermal-shearing cycling condition were investigated. The results show that Cu6 Sn5 forms at the two interfaces, and its thickness increases with the thermal-shearing cycling. The morphology of Cu6Sn5 varies from scallop-type to planar-type with increasing thermal-shearing cycling periods. The IMC growth follows growth kinetics of parabola, implying that IMC growth is controlled by Cu atom diffusion. In the solder, branch-like Ag3 Sn forms after reflowing, congregates to grow up to planar after thermal-shearing cycling.
作者 齐丽华 黄继华 张建纲 王烨 张华 赵兴科
机构地区 北京科技大学材料科学与工程学院
出处 《中国有色金属学报》 EI CAS CSCD 北大核心 2006年第10期1705-1709,共5页 The Chinese Journal of Nonferrous Metals
基金 国家自然科学基金资助项目(50371010)
关键词 Sn-3.5Ag-0.5Cu钎料 Sn-Pb钎料 热剪切循环 金属间化合物 Sn-3.5Ag-0.5Cu solder Sn-Pb solder thermal-shearing cycling intermetallic compound（IMC）
分类号 TG42 [金属学及工艺—焊接]
  • 相关文献

参考文献15

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二级参考文献23

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同被引文献78

引证文献9

二级引证文献92

中国有色金属学报
2006年 第10期

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