摘要
焊膏印刷是表面组装技术(SMT)工艺流程的第一道工序,控制焊膏印刷质量对电子产品的性能至关重要。从焊膏的性能、模版的质量和精度、印刷设备的性能和精度以及操作流程四个方面具体阐述了如何控制焊膏印刷质量,同时介绍了相关缺陷的解决办法。
Solder paste printing is the first step in surface mounting technology （SMT） procedures. To control solder paste printing quality is very important to working performance of electronic products. This article specifies how to control the solder paste in printing procedure in four facets： solder paste property, stencil quality, printing equipment precision and operational workflow. It also explains the solutions to the related defects.
出处
《丝网印刷》
2006年第10期1-6,共6页
Screen Printing
关键词
焊膏
表面组装
模版
质量控制
solder paste SMT stencil quality control
