基于AFM的化学机械抛光磨粒模拟研究

Simulation for an Abrasive Particle of the Chemical Mechanical Polishing with AFM

当前的化学机械抛光(CMP)磨损模型中大多数都缺少微观试验数据的支持。为进步揭示CMP中纳米磨粒对材料表面的磨损机制,提出了采用原子力显微镜(AFM)来模拟CMP中的单个磨粒的试验方案,并验证该模拟试验方案的可行性。结果表明:采用AFM探针来模拟CMP过程中单个磨粒对芯片表面的磨损与相互作用的试验方案是完全可行的;可以通过AFM探针对芯片表面的相互作用与磨损,模拟得出单个磨粒对芯片表面的作用与磨损状况,并可以在此微观试验数据的基础上建立起新的CMP磨损模型。

To study the micro-wear mechanism of a nano-partilce on material surface during the chemical mechanical polishing （CMP）, an experiment for using atomic force microscopy （AFM） to simulate a nano-partiele was put forward, and its feasibility was validated. The results show that it is feasibility to simulate the wear and interaction of a nano-partiele of the CMP on the wafer with AFM. Through the wear and interaction of the AFM＇ s tip on the wafer, the wear and interaction mechanism of a nano-partiele of the CMP on the wafer can be simulated and obtained ,and the new CMP model can be set up on the basis of micro-wear test data.