二丙基硅烷双酚A环氧树脂的表征及固化性能研究

Characterization of Siliconized Diallyl Bisphenol A Type Epoxy Resin and Study on Its Curing Properties

采用红外光谱(FT-IR)和核磁共振(29S i NMR)对3,3'-二(3-三甲氧基硅丙基)双酚A环氧树脂(SEP)进行了结构表征,并对其性能和固化进行了研究。该树脂为含烷氧硅基的环氧树脂,室温下可流动,室温下黏度比E51大,在60℃以上黏度相近。采用表干时间、DSC和FT-IR等对SEP的湿固化研究结果表明,该环氧树脂通过硅氧烷水解缩合而固化,表干时间随固化温度升高而减小。该环氧树脂可以像E-51一样用胺类固化剂进行固化,低温下凝胶时间稍长,90℃以上比较接近。

The structure of 3,3＇- di（3 - trimethoxysilicon propyl） bisphenol - A type epoxy resin （SEP） was characterized by FT - IR and ^29Si NMR and the properties including curing behavior of SEP were also studied. SEP was a novel silanized epoxy resin, which was of higher viscosity than normal bisphenol - A epoxy resin （ E -51 ） at room temperature and similar viscosity over 60 ℃. The moisture - activated curing properties and epoxy group - activated curing properties were studied by means of the gelling time, DSC and FT - IR. The results showed that the moisture curing behavior of SEP was contributed to the condensation reaction of methoxylsilyl group in molecular at the moisture conditions and the tack - free time decreased with the increase of temperature. SEP could also cure with amino curing agent just like E -51, but the gelling time was longer than E -51 at room temperature and similar over 90℃.