摘要
概述了面对无铅化,PCB制造厂应该采取什么措施来应对,无铅化PCB实质就是提高与解决PCB耐热可靠性问题。PCB厂家主要从以下几个方面加于控制解决:板材的选择、制程控制、表面工艺选用、过程质量存在问题分析。
his article summarize what actions PCB manufacturers should take for lead-free. The essential of leadfree PCB is to improve and solve reliability problem of the thermal resistance. The methods that PCB manufacturers should use are as follows： selection of copper clad laminates,process control, selection of surface finish, analysis of quality problems.
出处
《印制电路信息》
2006年第11期23-27,共5页
Printed Circuit Information
关键词
无铅化
高分解温度
ICT
lead-free high decomposition temperature ICT
