摘要
简述了现代集成电路制造工艺的发展状况,详细的介绍了制造工艺各技术节点离子注入工艺所面临的挑战及解决方案。
The paper depicted briefly the development, situation of the current IC fabrication process, and introduced the challenge and resolution of the ion implantation process relatively various technologic node.
出处
《电子工业专用设备》
2006年第11期5-8,74,共5页
Equipment for Electronic Products Manufacturing
关键词
离子注入
等效掺杂
大角度注入
低能大束流
Keywords ： Ion Implantation
Large tilt implantation
Low energy_high current
