3D-SoC的热设计计算

3D-SoC Thermal Design Computing

文章首先构建3D-SoC的热模型,接着推导3D-SoC的垂直互连模型,然后改造3D-IC的静态热分析为3D-SoC的动态热分析,包括内嵌散热微导管的优化设计。研究结论是,应用2003-ITRS的2006年数据,采用分形结构的碳纳米微导管做内嵌散热器,当顶层m=5的碳纳米微导管内嵌密度基为1%时,第5层的最高温升小于等于66℃。

This paper firstly built 3D-SoC Thermal Model, then derived its vertical interconnection model. Based on those I turned 3D-IC static thermal analysis into 3D-SoC dynamic thermal design, inside the important optimal design of embedded micro-C-pipe radiator was included. The conclusions were that the top （m=5） temperature rise would be below 66℃ if the top work-layer＇s micro-C-pipe embedded density basic factor had n=1% , with data of 2006 in 2003-ITRS, and in fractal structure of embedded radiator.