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Design of Rapid Thermal Processing for Large Diameter Wafer

Design of Rapid Thermal Processing for Large Diameter Wafer
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摘要 The relationship between the arrangement of tungsten-halogen lamps and the uniformity of irradiance received by the wafer is discussed, and a sort of ayial-symmetrical lamps-array is designed to guarantee that the irradiation on the edge is approximately the same as the one on the center of the wafer. The magnitude of temperature on the wafer vs. the power of tungsten-halogen lamps is calculated numerically. The relationship between the arrangement of tungsten-halogen lamps and the uniformity of irradiance received by the wafer is discussed, and a sort of axial-symmetrical lamps-array is designed to guarantee that the irradiation on the edge is approximately the same as the one on the center of the wafer. The magnitude of temperature on the wafer vs. the power of tungsten-halogen lamps is calculated numerically.
作者 YANG Hong-guan WEN Li-qun DAI Da-kang YU Biao
机构地区 Department of Applied Physics
出处 《Semiconductor Photonics and Technology》 CAS 2006年第4期265-269,共5页 半导体光子学与技术（英文版）
基金 Foundationfor Key Youth Teachers from Hunan Province(521105237) Natural Science Foundation of HunanUniversity(521101805)
关键词 大直径晶片 快速热处理 钨卤素灯 退火处理 Rapid thermal processing Rapid thermal annealing Tungsten-halogen lamp Large diameter wafer
分类号 TN305 [电子电信—物理电子学]
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参考文献22

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Semiconductor Photonics and Technology
2006年 第4期

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