期刊文献+

RYJ-II型热压成形设备实现压力均匀性的调平装置

A Precision Leveller for Achieving Pressure Uniformity on RYJ-II hot-embossing Machine
下载PDF
导出
摘要 针对热压成形设备中由于上下两热压面之间的不平行而引起的压力不均匀,设计了一种精密调平装置。对精密调平装置的设计原理、结构、调平方法和调平过程做了详细的讨论,最后通过实验验证精密调平装置能够准确的调节下热压面的姿态,使两个热压面的平行度达到10μm,实现热压过程中的压力均匀。 A precision leveller was designed for adjusting pressure ununifonnity, which was caused by Non-parallelism of the two embossing surfaces of the hot-embossing machine. The design theory, the structure and the adjust method of the precision leveller were presented in detail. In experiment, the both surfaces were adjusted accurately to be parallel by the precision leveller with parallelism error less than 10μm, and achieved pressure uniformity during the embossing process.
出处 《机电产品开发与创新》 2006年第5期59-61,共3页 Development & Innovation of Machinery & Electrical Products
基金 国家863高技术研究发展计划资助项目(2004AA404260)
关键词 精密调平装置 压力均匀性 热压成形设备 precision leveller pressure uniformity hot-embossing machine
  • 相关文献

参考文献3

二级参考文献6

  • 1姚立常,王家祯,李继勋,王庆祥,王智光,王毅.260激光电视电影经纬仪总体研制报告[J].光学精密工程,1995,3(5):1-19. 被引量:3
  • 2凌宁.大型经纬仪的底座与可变形调平机构[J].光学工程,1983,(3):9-18.
  • 3Lee G B, Chen S H, Huang G R, et al. Microfabricated Plastic Chips by Hot Embossing Methods and Their Application for DNA Separation and Dectection. Sensors and Actuators B, 2001,75(1-2):142~148
  • 4Ong N S, Koh Y H, Fu Y Q. Microlens Array Produced Using Hot Embossing Process. Microelectronic Engineering , 2002, 60:365~379
  • 5Becker H, Heim U. Hotembossing as a Method for the Fabrication of Polymer High Aspect Ratio Structures. Sensors and Actuators A, 2000,83 (1 -3) :130~135
  • 6杜俊峰,李正周.GD-220光电经纬仪轴系的精度分析[J].光学精密工程,2002,10(4):416-419. 被引量:32

共引文献18

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部