摘要
研究了时域有限差分(Finite-DifferenceTime-Domain,FDTD)法的三维细孔缝模拟问题,推导出基于CP(ContourPath)法的三维细孔缝仿真算法。在不同孔缝宽度模型下,分别利用细化网格和容性细孔缝(CompacitiveThin-SlotFormalism,C-TSF)两种算法验证三维CP细孔缝模型的精度和适应性。结果表明该CP模型在缝宽较大时精度较好,和C-TSF算法相结合在分析细孔缝电子机箱屏蔽问题时应避免使用细化网格。
Subcellular models of thin slots in the finite-difference time-domain (FDTD) method were investigated. A 3D thin-slot algorithm based on contour path (CP) method was presented for the application to the shielding analysis in electromagnetic compatibility (EMC). The accuracy and the applicability to the slot width were validated with finer mesh model or capacitive thin-slot formalism (C-TSF). The model taken by the comparison is originated from a thin slot in an enclosure wall. The numerical results indicate that the performance or accuracy will descend with the augment of the slot width. Good agreements with the results of finer mesh modeling can be expected as the slot width is on the order of the mesh dimension and quite large discrepancies from the results of C-TSF with the slot width far less than mesh. dimension. The 3D CP model will be utilized when the slot width is comparatively large and otherwise C-TSF. Taking advantage of both of them Will avoid finer mesh in thin slots modeling such as the shielding analysis of the electronic enclosure.
出处
《电工技术学报》
EI
CSCD
北大核心
2006年第10期7-11,共5页
Transactions of China Electrotechnical Society