5[4]Yokoi M,Konishi S.Interactions of Cl- and Brightener-component s in Copper Plating From an Acid Sulphate Bath[J].Metal Finishing SOC(Japan),198 3,34(8):434～439.
6[5]Sunghee Yoon,Morton Schwartz,CEF et al.Rotating Ring-Disk Ele ctrode Studies of Copper Electrodeposition Effect of Chloride Ion and Organic Ad ditives[J].Plating and Surface Finishing,1994,81(12):65.
7[6]Pradhan N,Krishna P G,Das S C.Influence of Chloride Ion on Electrocr ystallization of Copper[J].Plating and Surface Finishing,1996,83(3):56.
8[7]Tam T M,Christensen P J.Reaction Mechanism for the Electrodeposition of Copper Using Cyclic Voltammetry[J].Plating and Surface Finishing,1998,75(3 ):70.
9Apperson, R Duane, Clouser, et al. Electrodepositd Copper Foil and Process for Making Same Using Electrolyte Solutions Having Controlled Additions of Chloride Ions and Organic Additives [P]. USP 5403465, 1995-04-04.
10E Chassaing, R Wiart. Epitaxial Growth and Electrode Impadance of Copper Electrodeposits [J]. Electrochimica Acta, 1984,29(5):649-660.
