流延法制备低温烧结的高热导率AlN基片

Tape-casting Fabrication of Low-temperature Sintering AlN Substratewith High Thermal Conductivity

本文研究了流延法制备低温烧结的高热导率ＡｌＮ基片过程中影响流延浆料粘度的主要因素，结果表明，溶剂比例的增加会导致浆料粘度下降，增塑剂的减少则使粘度上升．本文还研究了添加剂对ＡｌＮ陶瓷烧结及热导性能的影响，实验表明Ｂ２Ｏ３能以过渡液相的形式促进烧结，而Ｄｙ２Ｏ３在低温下具有较好的去除ＡｌＮ晶格氧的能力．通过添加Ｄｙ２Ｏ３、Ｂ２Ｏ３等组成的混合助烧结剂；在１６５０℃下烧结４ｈ，获得了热导率高达１３０Ｗ／ｍ·Ｋ的ＡｌＮ基片．

Low-temperature sintering AIN substrate with high thermal conductivity was fabricated by tapecasting. Major influence on slurry viscosity was studied. Results show that the increase of solvent ratio and dcerease of plasticizer will cause the decrease and increase of viscosity respectively. Additive influence on the sintering and thermal property was also studied. Results show that B2 O3 can promote sintering process as transitional liquid. Dy2O3 can remove oxygen from AlN lattice effectively at low temperatule.Doping with Dy2O3, B2O3 and other additives, AlN substrate with thermal conductivity 130W/m K was obtained by sintering at 1650℃ for 4 hours.