单搭接接头峰值应力数值模拟的正交法分析

The orthogonal test of numerical modeling on the peck stress distributed in single lap joint

运用正交试验法研究了几个主要力学和几何参数如泊松比,弹性模量和被粘物厚对单搭接接头Von Mises等效应力的影响。有限元分析结果的极差分析、方差分析和最优方案的工程平均等结果表明:被粘物厚对单搭接接头Von Mises等效应力影响最大,弹性模量次之,泊松比影响程度最小。分析可知:高的泊松比、低弹性模量和被粘物厚的增大会使得Von Mises等效应力值显著降低。

The research is carried out with the method of orthogonal test to study the effects of some main parameters such as Poisson ratio,elastic modulus and adherend of thick on the peck value of the Von Mises equivalent stress distributed in adhesively bonded aluminium single lap joint. The results form elastic finite analysis as well as the range analysis,analysis of variance （ANOVA）and optimization project shown that the influence of adherend thickness is greatest among the three parameters on the peck value of Von Mises equivalent stress in single lap joint,the second is elastic modulus and the least is Poisson ratio. It is clear that increases adherend thickness or Poisson ratio as well as decreases the elastic modulus may decrease the peck value of Von Mises equivalent stress.