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无损伤超光滑LBO晶体表面抛光方法研究 被引量:3

Damage-free and super smooth surface of LBO crystal
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摘要 传统的抛光LBO晶体的方法是选用金刚石抛光粉在沥青抛光盘上抛光。沥青盘易于变形不容易修整,金刚石粉特别硬容易损伤抛光晶体表面。抛光过程中,抛光盘和抛光粉的选择是非常重要的,直接影响到抛光效率和最终的表面质量。新的抛光LBO晶体的方法,其抛光过程是一个化学机械过程,抛光盘、抛光粉和抛光材料相互作用。选用两种抛光盘(培纶和聚氨酯盘),三种较软的抛光磨料(CeO2,Al2O3和SiO2胶体),并在LBO晶体的(001)面进行抛光实验。用原子力显微镜测量和分析了表面粗糙度。结果表明,使用聚氨酯盘和SiO2胶体能够获得无损伤超光滑的LBO晶体表面,其表面粗糙度的RMS为0.3nm。 In conventional polishing of LBO crystal, the polishing pad is pitch, the polishing abrasive is diamond. The polishing LBO crystal surface using the conventional polishing method is very difficult, and easily generates damages of LBO crystal surface. The selection of the polishing pad and abrasive is very important, which directly influences the surface finishing. A new technique is used to polish LBO crystal in order to obtain darnage-free and super smooth surface. The polishing process is a chemical and mechanical proceos, which involves a simultaneous interaction among the polishing pad, the polishing abrasive and the material to be polished. In this study, two polishing pads (pelion and polyurethane), three soft polishing abrasives (colloidal SiO2, Al2O3 and CeO2) and LBO crystal (001) surface are involved. The surface roughness is measured by AFM. A damagefree and super smooth surface of LBO crystal with 0.3 nm RMS roughness is obtained by adopting the polyurethane pad and colloidal SiO2 in the experiments.
出处 《光学技术》 EI CAS CSCD 北大核心 2006年第6期838-841,共4页 Optical Technique
关键词 化学机械抛光 LBO晶体 超光滑表面 表面粗糙度 chemical mechanical polishing LBO crystal super smooth surface surface roughness
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参考文献13

  • 1Chen C T,Wu Y C,Jiang A,et al.New nonlinear-optical crystal:LiB3O5[J].J Opt Sco Am,1989,B 6:616-621.
  • 2Dmitriev V G,Gurzadyan G G,Nikogosyan D N.Handbook of nonlinear optical crystals[M].Springer,1999.
  • 3Mclntosh R B,Paquin R A.Chemical-mechanical polishing of low-scatter optical surfaces[J].Appl Opt,1980,19(14):2329-2331.
  • 4Bennett J M,Shaffer J J,Shibano Y,et al.Float polishing of optical materials[J].Appl Opt,1987,26(4):696-703.
  • 5Leistner A J,Thwaite E G,Lesha F,et al.Polishing study using Teflon and pitch laps to produce flat and supersmooth surfaces[J].Appl Opt,1992,31(10):1472-1482.
  • 6Jiang M,Wood N O,Komanduri R.On chemo-mechanical polishing (CMP) of silicon nitride (Si3N4) workmaterial with various abrasives[J].Wear,1998,220:59-71.
  • 7Chen C C A,Shu L S,Lee S R.Mechano-chemical polishing of silicon wafers[J].J Mater Process Technol,2003,140:373-378.
  • 8Yuan J L,Zhao P,Ruan J,et al.Lapping and polishing process for obtain super-smooth surface of quartz crystal[J].J Mater Process Technol,2003,138:116-119.
  • 9Steigerwaid J M,Murarka S P,Gutmann R J.Chemical mechanical planarization of Microelectronic materials[M].John Wiley & Sons,INC.:A Wiley-Interscience Publication,1997.
  • 10Hooper B J,Byrne G,Galligan S.Pad conditioning in chemical mechanical polishing[J].J Mater Process Technol,2002,123:107-113.

同被引文献35

  • 1徐进,苏亚,潘国顺,雒建斌.pH值和浓度对CeO_2抛光液性能影响的研究[J].润滑与密封,2005,30(4):9-11. 被引量:7
  • 2王燕芳,刘力,魏龙,单保慈.小动物正电子断层扫描仪(Micro-PET)技术概述[J].中国体视学与图像分析,2005,10(3):174-176. 被引量:9
  • 3李军,朱镛,陈创天.LBO晶体超光滑表面抛光机理[J].人工晶体学报,2007,36(1):18-21. 被引量:4
  • 4王之江.实用光学技术手册[M].北京:机械工业出版社,2006:682-693.
  • 5Chen C T,Wu Y C,Jiang A,et al. [J]. J Opt Sco Am, 1989,B6 : 616-621.
  • 6Dmitriev V G, Gurzadyan G G, Nikogosyan D N. Handbook of Nonlinear Optical Crystals 3rd Edn[M]. Germany: Soringer-Verlag Berlin Heidelberg, 1999. 68-77.
  • 7Prochnow E, Edwards D. [J]. Appl Opt, 1998, 37(28): 8130-8131.
  • 8Steigerwaid J M, Murarka S P, Gutmann R J. Chemical Mechanical Planarization of Microelectronic Materials [M]. John Wiley & Sons,INC:A Wiley-Interscience Publication, 1997.48-125.
  • 9Zantye P B, Kumar A, Sikder A K. [J]. Materials Science and Engineering R, 2004,45:89-220.
  • 10Stabia R,Stevens H J, Varner J R. [J]. J Non-cryst Solids, 1999,249 : 123-130.

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